Molex introduces its next-generation HSAutoLink G automotive Ethernet connector system to meet the growing demands of ADAS/computing and regional architecture.
Delivering up to 25Gbps of differential (STP/UTP) multi-gigabit automotive Ethernet performance, supporting ADAS, LiDAR, regional architecture, and central computing modules.
Leveraging USCAR-compliant designs and the deep technological foundation built on over 700 million HSAutoLink connectors and cables delivered since 2008, enhancing system integration and supply chain flexibility.
Improving mating quality with anti-residue terminal features and further enhancing packaging and cabling flexibility with a reversible housing design, directly addressing industry pain points.
Lille, Illinois – July 3, 2026 – Molex, a global leader in electronics and connectivity technology innovation, announced the expansion of its proven, field-tested HSAutoLink interconnect portfolio, which has delivered over 700 million connectors to the automotive industry since 2008. The new Molex HSAutoLink G connector system features a compact, USCAR-compliant interface design, providing multi-gigabit Ethernet connectivity up to 25Gbps. This makes it ideal for handling the increasing bandwidth demands of Advanced Driver Assistance Systems (ADAS), radar, LiDAR, regional architectures, immersive displays, and central computing modules.
Min Kong, Regional General Manager of Molex Connected Mobility Systems (CMS), stated, “As the automotive industry transitions to Software-Defined Vehicles (SDV), automakers must overcome significant performance bottlenecks while ensuring the highest levels of reliable connectivity. For nearly two decades, the HSAutoLink family has been a trusted cornerstone of automotive architecture. Building on this legacy, the new HSAutoLink G system provides OEMs with a field-proven upgrade path, enhancing supply chain flexibility and resilience, thereby shortening time-to-market.”
Design Flexibility and Robust Reliability
The Molex HSAutoLink G connector system is designed to adapt to existing USCAR Ethernet interfaces, offering a flexible and future-proof product design that reduces footprint and weight in compact modules while simplifying system integration and upgrades. Advanced electromagnetic interference (EMI) shielding and controlled differential impedance design ensure signal integrity for high-speed communication in high-density environments, helping to avoid signal failures, verification delays, and costly design changes.
Furthermore, this latest addition to the Molex HSAutoLink series features a reverse-pile design, protecting contacts during mating and reducing the risk of incorrect mating. Meeting stringent automotive industry verification standards, Molex has also added multiple standardized grounding contacts to enhance EMI suppression, further improving performance reliability.
Improved Supply Chain Options
The new Molex HSAutoLink G series, including terminals, connectors, printed circuit board (PCB) endplates, and cables, offers true sourcing options for automotive OEMs and Tier 1 suppliers through fully industry-standard USCAR package sizes. This standardized compatibility is backed by Molex's global manufacturing footprint and strong engineering support, supplemented by extensive real-world simulations and reliability testing to ensure optimized performance under the most demanding conditions.
Driving Innovation
Molex offers a full range of qualified alternative connector sources, crucial for China's rapidly iterating, high-volume market, and increasingly favored in other global sectors accelerating their transition to 25G automotive Ethernet. This continued growth trend underscores Molex's broader commitment to simplifying complex automotive electronic architectures: combining high-speed automotive communication protocol solutions such as HSAutoLink G and Molex HFM with advanced innovations like the Molex MX-DaSH connector system to achieve seamless integration of power, signal, and ultra-high-speed data transmission within a unified and space-saving architecture.
Building on a Legacy of Excellence in Automotive Connectivity
The Molex HSAutoLink series has long been a benchmark for rugged, high-speed automotive connectivity, encompassing HSAutoLink, HSAutoLink II, HSAutoLink C, and now HSAutoLink G. By elevating its proven technology to support Ethernet connectivity up to 25Gbps, Molex is further expanding its in-engine verification capabilities to meet the high-bandwidth demands of future SDV and autonomous driving platforms. HSAutoLink G samples are now available to help customers begin certification and design verification testing early.
Munich Shanghai Electronics Show 2026 Automotive Products Exhibition (Booth W1.301)
The new Molex HSAutoLink G system will be showcased at Munich Shanghai Electronics Show, along with the company's diverse portfolio of automotive connectivity products, including:
Electrification solutions to support the transition to electric vehicles (EVs) and next-generation architectures, such as the CMC/CMX connector system and the MX150 interconnect solution, supporting evolving electric drive, power control, and 48V architectures.
Battery pack interconnect solutions, such as the DuraClik wire-to-board connector solution, are suitable for compact, high-vibration, and high-temperature automotive applications, while the Flexi-Latch+ connector solution is suitable for supporting compact, lightweight automotive power and battery system architectures.
Lighting interconnect solutions, such as the Micro-Lock Plus connector solution, are suitable for compact automotive applications requiring durable mechanical and electrical performance, while the Nano-Fit connector solution enables reliable power delivery, electrical integrity, and flexible system integration in evolving automotive architectures.
